Veeco

AP200-300 Lithography Systems

AP200/300 Lithography Systems

AP200/300 Projection Steppers

The AP200/300 family of lithography systems is built on Veeco’s customizable Unity Platform™, delivering superior overlay, resolution and side wall profile performance and enabling highly-automated and cost- effective manufacturing. These systems are particularly well suited for copper pillar, fan-out, through-silicon via (TSV) and silicon interposer applications. In addition, the platform has numerous application-specific product features to enable next-generation packaging techniques, such as enhanced warped wafer handling, dual side alignment and Optical focus.

Key Features

• 2 µm resolution broadband projection lens designed for Advanced Packaging applications
• Exposure wavelength from 350 – 450 nm to handle a wide range of Advanced Packaging photosensitive materials
• Programmable wavelength selection (GHI, GH, I) for process optimization and process latitude
• High intensity illumination provides superior system throughput
• Large Depth-of-Focus for thick resist processes and large wafer topography
• High system throughput for favorable system cost of ownership
• High intensity illumination reduces exposure time
• Field size of 68 by 26mm exposes two scanner fields, reducing number of exposure steps per wafer
• Fast system stage and wafer input/output systems to minimize handling time