Singulus Technologies AG

Rotating-Substrate-Module

Rotating-Substrate Module (RSM)

Featuring 12 targets, DC/RF and various options to tilt and rotate the wafer, the Rotating-Substrate Module allows maximum flexibility for Production and Advanced Research in the Semiconductor Industry.

Sputtering and Process Modules for Semiconductor and Magnetics – Features:

• 300 mm and 200 mm wafer
• Up to 12 PVD cathodes, target Ø 100 mm
• Co-sputtering
• DC/RF sputtering
• Base pressure < 10-8 Torr
• Ion beam source (option)
• In-situ aligning magnetic field (option)
• Wafer heating (option)