Scia Systems GmbH

scia Trim 300

Precise Surface Correction by Ion Beam Trimming

The scia Trim 300 is a high-volume production system for ion beam trimming of 300 mm wafers without material restrictions. The precise local surface correction of the substrate is performed by a focused broad ion beam with a sufficient small focal point. Controlling the local material removal results in the etching of inhomogeneities up to an impressively uniform film, thus significantly increasing the yield of usable components.

FEATURES & BENEFITS

• Significant yield improvement
• Film thickness uniformity to be adjusted down to atom level of 0.1 nm
• No edge exclusion with electrostatic chuck
• Sub-nanometer removal with zero base etch function
• Processing of film and wafer materials without restrictions
• Throughput and maintenance optimized design for low production costs