Scia Systems GmbH

scia Trim 200

Precise Surface Correction

The scia Trim 200 is used for high precision surface trimming of wafers, without limitations in film and wafer materials. Designed for high-volume production the system has a throughput and maintenance optimized layout with a semiconductor cassette handling robot that accommodates all standard wafer sizes. In addition, a cluster configuration with two process chambers and two cassette load locks is available.

FEATURES & BENEFITS

• Significant yield improvement
• Film thickness homogeneity to be adjusted down to atom level of 0.1 nm
• No edge exclusion with electrostatic chuck
• Sub-nanometer removal with zero base etch function
• Processing of film and wafer materials without restrictions
• Throughput and maintenance optimized design for low production costs
• Processing of wafers with photoresist masks due to good wafer cooling