Scia Systems GmbH

scia Mill 150

Full Surface Ion Beam Etching on 150 mm Substrates

The scia Mill 150 is designed for structuring of complex multilayers of various materials. With its fully reactive gas compatibility the system also enables reactive etching processes with enhanced selectivity and rate. Due to its space saving design the scia Mill 150 is ideal for small scale production and R&D applications.

FEATURES & BENEFITS

• Etching angle adjustment with tiltable and rotatable substrate holder
• Excellent uniformity without shaper
• Enhanced selectivity and rate with reactive gases
• Process control with exact SIMS based or optical end point detection
• Carrier concept for adaptation to variable substrate sizes
• Processing of wafers with photoresist masks due to good wafer cooling