PacTech - Packaging Technologies

WIRE BONDING MACHINE

WIRE BONDING MACHINE

In precise, the technology we are providing is not “Wire Bonding” but “Wire Soldering”.

Wire soldering is the alternative method to get pad and wire connected. The benefit of this process can be summarized as following :

• No mechanical stress on the chip
• Wire shows more homogenous heat distribution with ampacity test
• Lower neck-break risk
• More flexible loop shape forming