PacTech - Packaging Technologies

LASER SOLDERING WITH SB2

LASER SOLDERING WITH SB²

PacTech’s laser solder jetting technology is clean, precise, and flexible. Our unique ball handling mechanism supplies a separated single solder ball into the capillary where the laser beam’s thermal energy melts the solder ball, and the solder is deposited to arbitrary positions and being reflowed immediately. It works with various solder alloys of different melting point and requires no flux therefore it is clean.

The localized heat and short pulse are generated by the laser that assures minimal thermal stress is applied on the area beyond the joined surfaces. The selective single solder ball dispensing mechanism requires no tooling for masking soldering locations, hence enables flexible soldering location and contactless soldering.