Congatec Asia Ltd.

conga-TC670

COM Express Type 6 Compact module based on 12th Gen Intel® Core™ embedded mobile processors (code name "Alder Lake")

• Intel® hybrid design combines Performance-cores with Efficient–cores
• Up to Intel® Iris® XeGraphics® architecture with up to 96 EUs
• PCI Express Gen 4 | USB 3.2
• AI Acceleration with Intel® Deep Learning Boost (VNNI)
• Embedded Use Condition SKUs