AT's New XCS Sensor Transforms the Electronics Industry

In the semiconductor industry, minute details can mean the difference between success and failure. AT – Automation Technology's newly launched 3D sensor from the XCS series is set to revolutionize high-performance applications in the electronics sector.

The standout features of the XCS sensor include its optimized laser and a very small field of view, down to 2.08 inches (53 mm). A key innovation is the laser's homogeneous thickness along the laser line, made possible by the sensor's special optics. This ensures precise scanning of even the smallest structures, whether they are in the middle or at the edge of the line. For customers, this means developing inspection applications with high repeatability and exceptional accuracy, a significant breakthrough in the precision inspection of ball grid arrays (BGAs).

Another critical advantage is AT's Clean Beam function. This technology shields the laser from external interference, such as optical anomalies, maintaining a precise and focused beam. Additionally, Clean Beam ensures a uniform intensity distribution, guaranteeing reliable and consistent results.

The XCS sensor's exceptional performance is further enhanced by its dual-head option. This feature eliminates occlusions, providing unparalleled high-resolution 3D scanning at extreme speeds. The 3070 WARP version of the sensor reaches profile speeds of up to 140 kHz, allowing for rapid and efficient analysis of large 3D scan data volumes.

With the introduction of the XCS series, AT – Automation Technology reaffirms its role as a leader in automation technology. The sensor is available now and is set to become essential for numerous electronics applications.

In summary, the XCS sensor offers the following advantages:

• Unique 3D scan results without occlusion due to dual-head option and extremely high resolution
• High precision and detection of the smallest surface details thanks to high-quality laser line projection
• Unrivaled resolution for electronics inspection (e.g. BGA inspection) with a field of view of up to 2.08 in (53 mm)
• Highest inspection speed possible with the 3070 WARP sensor variant