DFI Inc.

DFI Inc.

Xizhi District, New Taipei City, 22175, TAIWAN (R.O.C.)

Module Boards SDVO-LVDS

Module Boards SDVO-LVDS

Module Boards, CHIP: Chrontel CH7308B, PORT: 1 LVDS, Dimensions: 45mm x 38mm (1.77" x 1.49")

Module Boards SDVO-LVDS Characteristics:

CHIP: Chrontel CH7308B LVDS transmitter chip

Features:

Single/Dual LVDS transmitter up to 165Mpixels/s

LVDS low jitter PLL accepts spread spectrum input

Supports 18/24-bit 1600x1200 LVDS panel

Supports dimming control via hot-keys

2D dither engine

Panel protection and power sequencing

High-speed SDVO I serial (1G~2Gbps) ACcoupled differential RGB inputs

Low voltage interface supports graphics device

Programmable power management

Fully programmable through OpCodes I

Supports complete Windows driver

Supports boundary scan

TEMPERATURE: 0°C to 60°C

DIMENSIONS:

45mm (1.77") x 38mm (1.49")

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