Fanless Embedded System eBOX670-891-FL
Fanless Embedded System with LGA1151 Socket 6th/7th Gen Intel® Core™ i7/i5/i3 & Celeron® Processor, Intel® Q170, 2 HDMI, 1 DisplayPort, 4 GbE LANs, 6 USB 3.0, Dual Mini PCIe Card Slots and Wide Range DC-in, LGA1151 socket 6th/7th Intel® Core™ i7/i5/i3 & Celeron® processors (Skylake/Kaby Lake), 260-pin DDR4-2133 SO-DIMM, up to 32GB, 2 internal PCI Express Mini Cards and 1 SIM slot for WLAN/WWAN/mSATA, 1 DisplayPort and 2 HDMI (1 HDMI 2.0) with triple-view supported, Supports Jumbo Frame (9.5k), WoL, PXE Remote Boot, Teaming, 9 - 36 VDC wide range power input, Flexible I/O module design.
Fanless Embedded System eBOX670-891-FL Characteristics:
CPU LGA1151 socket 7th/6th gen Intel® Core™ i7/i5/i3 & Celeron® processor (CPU TDP max. up to 35 W)
Chipset Intel® Q170
System Memory 2 x 260-pin SO-DIMM DDR4-2133, up to 32 GB
USB 6 x USB 3.0
2 x USB 2.0
Storage 2 x 2.5" SATA HDD with RAID 0&1
1 x CFast™
1 x mSATA
Operating Temperature -40°C ~ +60°C (-40°F ~ +140°F) (with W.T. SSD, CPU TDP 35W)
